AMD Ryzen AI 9 HX 370 (Strix Point)
The Ryzen AI 9 HX 370 is AMD’s top-tier Strix Point APU, built on a 4nm process. It represents the generation immediately before the Strix Halo family and was the AMD flagship for Windows handhelds through 2024–2025. In the DROIX lineup it powers the AYANEO Flip 1S DS variant.
Key Specs
| Spec | Value |
|---|---|
| CPU | 12 cores / 24 threads (4× Zen 5 + 8× Zen 5c) |
| GPU | AMD Radeon 890M (12 CUs, RDNA 3.5) |
| NPU | XDNA 2 (50 TOPS) |
| TDP | 28–54W |
| Process | 4nm TSMC |
Products Using This Chip
- ayaneo-flip-1s-ds — dual-screen Windows clamshell; variant: ayaneo-flip-1s-ds-hx-370
- onexplayer-onexfly-f1-pro — 7” OLED 144Hz handheld (HX 370 as top-tier option alongside HX 365 and 8840U)
- onexplayer-x1-pro — 10.95” 3-in-1 tablet/handheld
- gpd-pocket-4 — convertible UMPC; variant: gpd-pocket-4-ai-370
Performance Context
The HX 370 occupies the tier below the Strix Halo family. It delivers strong productivity and lighter gaming performance in the 28–54W TDP range but is outperformed at higher TDPs by the Strix Halo APUs used in gpd-win-5 and onexplayer-onexfly-apex. See windows-handheld-gaming for comparative notes.